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Data Sheet, Rev. 1.1, Nov. 2007
BTN7930
High Current PN Half Bridge NovalithICTM
Automotive Power
High Current PN Half Bridge BTN7930
Table of Contents
1 2 2.1 2.2 3 3.1 3.2 4 4.1 4.2 4.3 5 5.1 5.2 5.2.1 5.2.2 5.2.3 5.3 5.3.1 5.3.2 5.3.3 5.3.4 5.3.5 5.3.6 5.4 5.4.1 5.4.2 5.4.3 5.4.4 5.4.5 5.4.6 6 6.1 6.2 6.3 7 7.1 7.2 7.3 8 Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Terms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Pin Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Pin Assignment . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Pin Definitions and Functions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 General Product Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Functional Range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Thermal Resistance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 6 8 8
Block Description and Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Supply Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Power Stages . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Power Stages - Static Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Switching Times . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Power Stages - Dynamic Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Protection Functions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Overvoltage Lock Out . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Undervoltage Shut Down . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Overtemperature Protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Current Limitation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Short Circuit Protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 Electrical Characteristics - Protection Functions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 Control and Diagnostics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 Input Circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 Dead Time Generation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 Adjustable Slew Rate . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 Status Flag Diagnosis With Current Sense Capability . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 Truth Table . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 Electrical Characteristics - Control and Diagnostics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 Application Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Application Example . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Layout Considerations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Half-bridge Configuration Considerations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Package Outlines . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . PG-TO263-7-1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . PG-TO220-7-11 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . PG-TO220-7-12 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 22 22 23 24 24 25 26
Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
Data Sheet
2
Rev. 1.1, 2007-11-21
High Current PN Half Bridge NovalithICTM
BTN7930B BTN7930P BTN7930S
1
Features *
Overview
Path resistance of max. 55 m @ 150 C (typ. 28 m @ 25 C) High Side: max. 17 m @ 150 C (typ. 10 m @ 25 C) Low Side: max. 38 m @ 150 C (typ. 18 m @ 25 C) (for BTN7930B (SMD)) Low quiescent current of typ. 7 A @ 25 C PWM capability of up to 25 kHz combined with active freewheeling Switched mode current limitation for reduced power dissipation in overcurrent Current limitation level of 20 A min. / 32 A typ. (low side) Status flag diagnosis with current sense capability Overtemperature shut down with latch behaviour Overvoltage lock out Undervoltage shut down Driver circuit with logic level inputs Adjustable slew rates for optimized EMI Green Product (RoHS compliant) AEC Qualified
* * * * * * * * * * * *
PG-TO263-7-1
Description The BTN7930 is a integrated high current half bridge for motor drive applications. It is part of the NovalithICTM family containing one p-channel highside MOSFET and one n-channel lowside MOSFET with an integrated driver IC in one package. Due to the p-channel highside switch the need for a charge pump is eliminated thus minimizing EMI. Interfacing to a microcontroller is made easy by the integrated driver IC which features logic level inputs, diagnosis with current sense, slew rate adjustment, dead time generation and protection against overtemperature, overvoltage, undervoltage, overcurrent and short circuit. The BTN7930 provides a cost optimized solution for protected high current PWM motor drives with very low board space consumption. PG-TO220-7-12 PG-TO220-7-11
Type BTN7930B BTN7930P BTN7930S Data Sheet
Package PG-TO263-7-1 PG-TO220-7-11 PG-TO220-7-12 3
Marking BTN7930B BTN7930P BTN7930S Rev. 1.1, 2007-11-21
High Current PN Half Bridge BTN7930
Block Diagram
2
Block Diagram
The BTN7930 is part of the NovalithICTM family containing three separate chips in one package: One p-channel highside MOSFET and one n-channel lowside MOSFET together with a driver IC, forming a integrated high current half-bridge. All three chips are mounted on one common lead frame, using the chip on chip and chip by chip technology. The power switches utilize vertical MOS technologies to ensure optimum on state resistance. Due to the p-channel highside switch the need for a charge pump is eliminated thus minimizing EMI. Interfacing to a microcontroller is made easy by the integrated driver IC which features logic level inputs, diagnosis with current sense, slew rate adjustment, dead time generation and protection against overtemperature, overvoltage, undervoltage, overcurrent and short circuit. The BTN7930 can be combined with other BTN7930 to form H-bridge and 3-phase drive configurations.
2.1
Block Diagram
VS
Undervolt. detection
Overvolt. detection
Current Sense
Overcurr. Detection HS Overtemp. detection IS Digital Logic IN Gate Driver HS
LS off HS off
OUT
Gate Driver LS
INH
SR
Slewrate Adjustment
Overcurr. Detection LS GND
Figure 1
Block Diagram
2.2
Terms
Following figure shows the terms used in this data sheet.
VS I IN
IN VS
I VS , -I D( HS)
VDS (HS )
V IN V INH VSR
IINH
INH
I OUT , I L
O UT
ISR
SR
VSD (LS )
V OUT
I IS
IS G ND
V IS
IGND , I D( LS)
Figure 2 Data Sheet
Terms 4 Rev. 1.1, 2007-11-21
High Current PN Half Bridge BTN7930
Pin Configuration
3
3.1
Pin Configuration
Pin Assignment
8
8
8
1234 5 67
1234567
1 23 45 6 7
Figure 3 Pin Assignment BTN7930B, BTN7930P and BTN7930S (top view)
3.2
Pin 1 2 3 4,8 5
Pin Definitions and Functions
Symbol GND IN INH OUT SR I/O I I O I Function Ground Input Defines whether high- or lowside switch is activated Inhibit When set to low device goes in sleep mode Power output of the bridge Slew Rate The slew rate of the power switches can be adjusted by connecting a resistor between SR and GND Current Sense and Diagnostics Supply
6 7
IS VS
O -
Bold type: pin needs power wiring
Data Sheet
5
Rev. 1.1, 2007-11-21
High Current PN Half Bridge BTN7930
General Product Characteristics
4
4.1
General Product Characteristics
Absolute Maximum Ratings
Absolute Maximum Ratings 1)
Tj = -40 C to +150 C; all voltages with respect to ground, positive current flowing into pin
(unless otherwise specified) Pos. Voltages 4.1.1 4.1.2 4.1.3 4.1.4 4.1.5 Currents 4.1.6 HS/LS Continuous Drain Current2) Supply Voltage Logic Input Voltage Voltage at SR Pin Voltage between VS and IS Pin Voltage at IS Pin Parameter Symbol Min. Limit Values Max. 45 5.3 1.0 45 45 20 18 50 V V V V V A A A - - - - - Unit Conditions
VS VIN VINH VSR VS -VIS VIS ID(HS) ID(LS)
-0.3 -0.3 -0.3 -0.3 -20 -20 -18
TC < 85C switch active TC < 125C switch active TC < 85C tpulse = 10ms
single pulse
4.1.7
HS/LS Pulsed Drain Current2)
ID(HS) ID(LS)
-50
-46
46
A
TC < 125C tpulse = 10ms
single pulse
4.1.8
HS/LS PWM Current
2)
ID(HS) ID(LS)
-26 -23 -28 -25
26 23 28 25
A A A A
TC < 85C f = 1kHz, DC = 50% TC < 125C f = 1kHz, DC = 50% TC < 85C f = 20kHz, DC = 50% TC < 125C f = 20kHz, DC = 50%
- - HBM3)
Temperatures 4.1.9 4.1.10 4.1.11 Junction Temperature Storage Temperature ESD Susceptibility HBM IN, INH, SR, IS OUT, GND, VS
Tj Tstg VESD
-40 -55
150 150
C C kV
ESD Susceptibility
-2 -4
2 4
1) Not subject to production test, specified by design 2) Maximum reachable current may be smaller depending on current limitation level 3) ESD susceptibility, HBM according to EIA/JESD22-A114-B (1.5 k, 100 pF)
Data Sheet
6
Rev. 1.1, 2007-11-21
High Current PN Half Bridge BTN7930
General Product Characteristics Note: Stresses above the ones listed here may cause permanent damage to the device. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Note: Integrated protection functions are designed to prevent IC destruction under fault conditions described in the data sheet. Fault conditions are considered as "outside" normal operating range. Protection functions are not designed for continuous repetitive operation.
Maximum Single Pulse Current
60
50
40
|I max| [A]
30
20
10 0 1,0E-03
1,0E-02
1,0E-01 t pulse[s]
1,0E+00
1,0E+01
Figure 4
BTN7930 Maximum Single Pulse Current (TC < 85C)
This diagram shows the maximum single pulse current that can be driven for a given pulse time tpulse. The maximum reachable current may be smaller depending on the current limitation level. Pulse time may be limited due to thermal protection of the device.
Data Sheet
7
Rev. 1.1, 2007-11-21
High Current PN Half Bridge BTN7930
General Product Characteristics
4.2
Pos. 4.2.1 4.2.2 4.2.3
Functional Range
Parameter Supply Voltage Range for Nominal Operation Symbol Min. Limit Values Max. 18 28 150 V V C - Parameter Deviations possible - 8 5.5 -40 Unit Conditions
VS(nom)
Extended Supply Voltage Range for VS(ext) Operation Junction Temperature
Tj
Note: Within the functional or operating range, the IC operates as described in the circuit description. The electrical characteristics are specified within the conditions given in the Electrical Characteristics table.
4.3
Pos. 4.3.1
Thermal Resistance
Parameter Thermal Resistance Junction-Case, Low Side Switch1) Rthjc(LS) = Tj(LS)/ Pv(LS) Thermal Resistance Junction-Case, High Side Switch1) Rthjc(HS) = Tj(HS)/ Pv(HS) Thermal Resistance Junction-Case, both Switches1) Rthjc = max[Tj(HS), Tj(LS)] / (Pv(HS) + Pv(LS)) Thermal Resistance Junction-Ambient1) Symbol Min. Limit Values Typ. 3.6 Max. 4.8 K/W - Unit Conditions
RthJC(LS) -
4.3.2
RthJC(HS) -
1.1
1.6
K/W
-
4.3.3
RthJC
-
1.8
2.4
K/W
-
4.3.4
RthJA
-
21
-
K/W
2)
1) Not subject to production test, specified by design 2) Specified RthJA value is according to Jedec JESD51-2,-5,-7 at natural convection on FR4 2s2p board; The Product (chip+package) was simulated on a 76.2 x 114.3 x 1.5 mm board with 2 inner copper layers (2 x 70 m Cu, 2 x 35 m Cu).
Data Sheet
8
Rev. 1.1, 2007-11-21
High Current PN Half Bridge BTN7930
Block Description and Characteristics
5
5.1
Block Description and Characteristics
Supply Characteristics
VS = 8 V to 18 V, Tj = -40 C to +150 C, IL = 0 A, all voltages with respect to ground, positive current flowing into pin
(unless otherwise specified) Pos. General 5.1.1 Supply Current Parameter Symbol Min. Limit Values Typ. 2 Max. 3 mA Unit Conditions
IVS(on)
-
VINH = 5 V VIN = 0 V or 5 V RSR = 0
DC-mode normal operation (no fault condition)
5.1.2
Quiescent Current
IVS(off)
-
7
12
A
-
-
65
A
VINH = 0 V VIN = 0 V or 5 V Tj < 85 C VINH = 0 V VIN = 0 V or 5 V
25
I V S (o f f ) [A]
20
15
10
5
0 -40 0 40 80 120 160
T [C]
Figure 5
Typical Quiescent Current vs. Junction Temperature
Data Sheet
9
Rev. 1.1, 2007-11-21
High Current PN Half Bridge BTN7930
Block Description and Characteristics
5.2
Power Stages
The power stages of the BTN7930 consist of a p-channel vertical DMOS transistor for the high side switch and a n-channel vertical DMOS transistor for the low side switch. All protection and diagnostic functions are located in a separate top chip. Both switches can be operated up to 25 kHz, allowing active freewheeling and thus minimizing power dissipation in the forward operation of the integrated diodes. The on state resistance RON is dependent on the supply voltage VS as well as on the junction temperature Tj. The typical on state resistance characteristics are shown in Figure 6.
High Side Switch
40
Low Side Switch
70
RON(HS) [m]
35 30 25
RON(LS ) [m]
60
50
40
20 15 10 5 4 8 12 16 20 24 28 VS [V]
Tj = 150C Tj = 25C Tj = -40C
30
Tj = 150C
20
Tj = 25C Tj = -40C
10 4 8 12 16 20 24 28
VS [V]
Figure 6
Typical ON State Resistance vs. Supply Voltage (BTN7930B)
Data Sheet
10
Rev. 1.1, 2007-11-21
High Current PN Half Bridge BTN7930
Block Description and Characteristics
5.2.1
Power Stages - Static Characteristics
VS = 8 V to 18 V, Tj = -40 C to +150 C, all voltages with respect to ground, positive current flowing into pin
(unless otherwise specified) Pos. Parameter Symbol Min. High Side Switch - Static Characteristics 5.2.1 ON State High Side Resistance1) RON(HS) - - - - - - 5.2.2 Leakage Current High Side 10 14 10.8 15.2 10.1 14.2 - - - 17 - 18.2 - 17.2 1 50 A A V - - - 0.9 0.8 0.6 1.5 1.1 0.8 m - - - - - - 5.2.5 Leakage Current Low Side 18 28 18.8 29.2 18.1 28.2 - - - 38 - 39.2 - 38.2 1 10 A A V - - - 0.9 0.8 0.7 1.5 1.1 0.9 m Limit Values Typ. Max. Unit Conditions
IOUT = 8 A; VS = 13.5 V
BTN7930B Tj = 25 C Tj = 150 C BTN7930P
Tj = 25 C Tj = 150 C
BTN7930S
IL(LKHS)
- -
5.2.3
Reverse Diode Forward-Voltage VDS(HS) High Side2)
Tj = 25 C Tj = 150 C VINH = 0 V; VOUT = 0 V Tj < 85 C VINH = 0 V; VOUT = 0 V Tj = 150 C IOUT = -8 A Tj = -40 C Tj = 25 C Tj = 150 C IOUT = -8 A; VS = 13.5 V
BTN7930B
Low Side Switch - Static Characteristics 5.2.4 ON State Low Side Resistance1) RON(LS)
Tj = 25 C Tj = 150 C
BTN7930P Tj = 25 C Tj = 150 C BTN7930S
IL(LKLS)
- -
5.2.6
Reverse Diode Forward-Voltage VSD(LS) Low Side2)
Tj = 25 C Tj = 150 C VINH = 0 V; VOUT = VS Tj < 85 C VINH = 0 V; VOUT = VS Tj = 150 C IOUT = 8 A Tj = -40 C Tj = 25 C Tj = 150 C
1) Specified RON value is related to normal soldering points; RON values is specified for BTN7930B: pin 1,7 to pin 8 (tab, backside) and for BTN7930P/BTN7930S: pin 1,7 to pin4 2) Due to active freewheeling, diode is conducting only for a few s, depending on RSR
Data Sheet
11
Rev. 1.1, 2007-11-21
High Current PN Half Bridge BTN7930
Block Description and Characteristics
5.2.2
Switching Times
IN t dr(HS ) VOUT
90% 90%
t r(HS )
t df (HS )
tf (HS )
t
VOUT
VOUT
10%
10%
t
Figure 7 Definition of switching times high side (Rload to GND)
IN tdf (LS ) VOUT
90% 90%
t f (LS )
tdr(LS )
tr(LS )
t
V OUT
VOUT
10%
10%
t
Figure 8 Definition of switching times low side (Rload to VS)
Due to the timing differences for the rising and the falling edge there will be a slight difference between the length of the input pulse and the length of the output pulse. It can be calculated using the following formulas: * *
tHS = (tdr(HS) + 0.5 tr(HS)) - (tdf(HS) + 0.5 tf(HS)) tLS = (tdf(LS) + 0.5 tf(LS)) - (tdr(LS) + 0.5 tr(LS)).
Data Sheet
12
Rev. 1.1, 2007-11-21
High Current PN Half Bridge BTN7930
Block Description and Characteristics
5.2.3
Power Stages - Dynamic Characteristics
VS = 13.5 V, Tj = -40 C to +150 C, Rload = 4 , all voltages with respect to ground, positive current flowing into pin
(unless otherwise specified) Pos. Parameter Symbol Min. High Side Switch Dynamic Characteristics 5.2.7 Rise-Time of HS Limit Values Typ. Max. s 0.5 - 2 5.2.8 Slew Rate HS on1) 1 2 5 10.8 5.4 2.2 3.1 4.4 14 1 2 5 10.8 5.4 2.2 1.6 - 11 V/s 6.8 - 1 1.5 - 5 5.2.10 Fall-Time of HS 21.6 - 5.4 s 4.5 - 25 s 0.5 - 2 5.2.11 Slew Rate HS off1) 1.6 - 11 V/s 21.6 - 5.4 s Unit Conditions
tr(HS)
RSR = 0 RSR = 5.1 k RSR = 51 k RSR = 0 RSR = 5.1 k RSR = 51 k RSR = 0 RSR = 5.1 k RSR = 51 k RSR = 0 RSR = 5.1 k RSR = 51 k RSR = 0 RSR = 5.1 k RSR = 51 k RSR = 0 RSR = 5.1 k RSR = 51 k
VOUT/ tr( HS)
5.2.9
Switch on Delay Time HS
tdr(HS)
tf(HS)
-VOUT/ tf(HS) 6.8
- 1
5.2.12
Switch off Delay Time HS
tdf(HS)
1 2.4 3 - 3.4 - 3 10 17 1) Not subject to production test, calculated value; |VOUT|/ tr(HS) or |-VOUT|/ tf(HS)
Data Sheet
13
Rev. 1.1, 2007-11-21
High Current PN Half Bridge BTN7930
Block Description and Characteristics
VS = 13.5 V, Tj = -40 C to +150 C, Rload = 4 , all voltages with respect to ground, positive current flowing into pin
(unless otherwise specified) Pos. Parameter Symbol Min. Low Side Switch Dynamic Characteristics 5.2.13 Rise-Time of LS Limit Values Typ. Max. s 0.4 - 2 5.2.14 Slew Rate LS switch off1) 0.9 2 5 12 5.4 2.2 1.3 2.2 5 1 2 5 10.8 5.4 2.2 1.4 - 11 V/s 7.7 - 1 0.6 - 2 5.2.16 Fall-Time of LS 27 - 5.4 s 2 - 11 s 0.5 - 2 5.2.17 Slew Rate LS switch on1) 1.5 - 11 V/s 7.2 - 1 21.6 - 5.4 s Unit Conditions
tr(LS)
VOUT/
tr(LS)
RSR = 0 RSR = 5.1 k RSR = 51 k RSR = 0 RSR = 5.1 k RSR = 51 k RSR = 0 RSR = 5.1 k RSR = 51 k RSR = 0 RSR = 5.1 k RSR = 51 k RSR = 0 RSR = 5.1 k RSR = 51 k RSR = 0 RSR = 5.1 k RSR = 51 k
5.2.15
Switch off Delay Time LS
tdr(LS)
tf(LS)
tf(LS)
-VOUT/
5.2.18
Switch on Delay Time LS
tdf(LS)
2 4 5 - 5.6 - 5 15 25 1) Not subject to production test, calculated value; |VOUT|/ tr(LS) or |-VOUT|/ tf(LS)
Data Sheet
14
Rev. 1.1, 2007-11-21
High Current PN Half Bridge BTN7930
Block Description and Characteristics
5.3
Protection Functions
The device provides integrated protection functions. These are designed to prevent IC destruction under fault conditions described in the data sheet. Fault conditions are considered as "outside" normal operating range. Protection functions are not to be used for continuous or repetitive operation, with the exception of the current limitation (Chapter 5.3.4). In a fault condition the BTN7930 will apply the highest slew rate possible independent of the connected slew rate resistor. Overvoltage, overtemperature and overcurrent are indicated by a fault current IIS(LIM) at the IS pin as described in the paragraph "Status Flag Diagnosis With Current Sense Capability" on Page 19 and Figure 12. In the following the protection functions are listed in order of their priority. Overvoltage lock out overrides all other error modes.
5.3.1
Overvoltage Lock Out
To assure a high immunity against overvoltages (e.g. load dump conditions) the device shuts the lowside MOSFET off and turns the highside MOSFET on, if the supply voltage is exceeding the over voltage protection level VOV(OFF). The IC operates in normal mode again with a hysteresis VOV(HY) if the supply voltage decreases below the switchon voltage VOV(ON). In H-bridge configuration, this behavior of the BTN7930 will lead to freewheeling in highside during over voltage.
5.3.2
Undervoltage Shut Down
To avoid uncontrolled motion of the driven motor at low voltages the device shuts off (output is tri-state), if the supply voltage drops below the switch-off voltage VUV(OFF). The IC becomes active again with a hysteresis VUV(HY) if the supply voltage rises above the switch-on voltage VUV(ON).
5.3.3
Overtemperature Protection
The BTN7930 is protected against overtemperature by an integrated temperature sensor. Overtemperature leads to a shut down of both output stages. This state is latched until the device is reset by a low signal with a minimum length of treset at the INH pin, provided that its temperature has decreased at least the thermal hysteresis T in the meantime. Repetitive use of the overtemperature protection impacts lifetime.
5.3.4
Current Limitation
The current in the bridge is measured in both switches. As soon as the current in forward direction in one switch (high side or low side) is reaching the limit ICLx, this switch is deactivated and the other switch is activated for tCLS. During that time all changes at the IN pin are ignored. However, the INH pin can still be used to switch both MOSFETs off. After tCLS the switches return to their initial setting. The error signal at the IS pin is reset after 2 * tCLS. Unintentional triggering of the current limitation by short current spikes (e.g. inflicted by EMI coming from the motor) is suppressed by internal filter circuitry. Due to thresholds and reaction delay times of the filter circuitry the effective current limitation level ICLx depends on the slew rate of the load current dI/dt as shown in Figure 10.
Data Sheet
15
Rev. 1.1, 2007-11-21
High Current PN Half Bridge BTN7930
Block Description and Characteristics
IL ICLx ICLx 0
tCLS
t
Figure 9 Timing Diagram Current Limitation (Inductive Load)
High Side Switch
55 50
Low Side Switch
55
I C L H [A]
45 40 35 30 25 20 0 500 1000
I C L L [A]
Tj = 25C
Tj = -40C
50 45 40
Tj = 150C
ICLH0
ICLL0
35 30 25 20
1500 2000
Tj = 25C
Tj = -40C
Tj = 150C
0
500
1000
1500
2000
dIL/dt [A/ms]
Figure 10 Typical Current Limitation Level vs. Current Slew Rate dI/dt
dIL/dt [A/ms]
Data Sheet
16
Rev. 1.1, 2007-11-21
High Current PN Half Bridge BTN7930
Block Description and Characteristics
High Side Switch
50
Low Side Switch
50
I C L H [ A]
I C L L [ A]
45
Tj = -40C Tj = 25C
45
40
Tj = 150C
40
35
35
Tj = -40C Tj = 25C
30
30
Tj = 150C
25
25
20 4 6 8 10 12 14 16 18 20
20 4 6 8 10 12 14 16 18 20
VS [V]
Figure 11 Typical Current Limitation Detection Levels vs. Supply Voltage
VS [V]
In combination with a typical inductive load, such as a motor, this results in a switched mode current limitation. This method of limiting the current has the advantage of greatly reduced power dissipation in the BTN7930 compared to driving the MOSFET in linear mode. Therefore it is possible to use the current limitation for a short time without exceeding the maximum allowed junction temperature (e.g. for limiting the inrush current during motor start up). However, the regular use of the current limitation is allowed as long as the specified maximum junction temperature is not exceeded. Exceeding this temperature can reduce the lifetime of the device.
5.3.5
* * *
Short Circuit Protection
The device is short circuit protected against output short circuit to ground output short circuit to supply voltage short circuit of load
The short circuit protection is realized by the previously described current limitation in combination with the overtemperature shut down of the device.
Data Sheet
17
Rev. 1.1, 2007-11-21
High Current PN Half Bridge BTN7930
Block Description and Characteristics
5.3.6
Electrical Characteristics - Protection Functions
VS = 8 V to 18 V, Tj = -40 C to +150 C, all voltages with respect to ground, positive current flowing into pin
(unless otherwise specified) Pos. Parameter Under Voltage Shut Down 5.3.1 5.3.2 5.3.3 5.3.4 5.3.5 5.3.6 5.3.7 5.3.8 Switch-ON Voltage Switch-OFF Voltage ON/OFF hysteresis Switch-ON Voltage Switch-OFF Voltage ON/OFF hysteresis Symbol Min. Limit Values Typ. - - 0.2 - - 0.2 42 32 Max. 5.5 5.4 - - 30 - 54 44 V V V V V V A A Unit Conditions
VUV(ON) - VUV(OFF) 4.0 VUV(HY) - VOV(ON) 27.8 VOV(OFF) 28 VOV(HY) -
30 20
VS increasing VS decreasing
-
Over Voltage Lock Out
VS decreasing VS increasing
-
Current Limitation Current Limitation Detection level ICLH0 High Side Current Limitation Detection level ICLL0 Low Side Shut OFF Time for HS and LS Thermal Shut Down Junction Temperature Thermal Switch ON Junction Temperature Thermal Hysteresis
VS = 13.5 V VS = 13.5 V
Current Limitation Timing 5.3.9 5.3.10 5.3.11 5.3.12 5.3.13
tCLS TjSD TjSO
T
70 155 150 - 4
115 175 - 7 -
210 200 190 - -
s C C K s
VS = 13.5 V
- - - -
Thermal Shut Down
Reset Pulse at INH Pin (INH low) treset
Data Sheet
18
Rev. 1.1, 2007-11-21
High Current PN Half Bridge BTN7930
Block Description and Characteristics
5.4 5.4.1
Control and Diagnostics Input Circuit
The control inputs IN and INH consist of TTL/CMOS compatible schmitt triggers with hysteresis which control the integrated gate drivers for the MOSFETs. Setting the INH pin to high enables the device. In this condition one of the two power switches is switched on depending on the status of the IN pin. To deactivate both switches, the INH pin has to be set to low. No external driver is needed. The BTN7930 can be interfaced directly to a microcontroller, as long as the maximum ratings in Chapter 4.1 are not exceeded.
5.4.2
Dead Time Generation
In bridge applications it has to be assured that the highside and lowside MOSFET are not conducting at the same time, connecting directly the battery voltage to GND. This is assured by a circuit in the driver IC, generating a so called dead time between switching off one MOSFET and switching on the other. The dead time generated in the driver IC is automatically adjusted to the selected slew rate.
5.4.3
Adjustable Slew Rate
In order to optimize electromagnetic emission, the switching speed of the MOSFETs is adjustable by an external resistor. The slew rate pin SR allows the user to optimize the balance between emission and power dissipation within his own application by connecting an external resistor RSR to GND.
5.4.4
Status Flag Diagnosis With Current Sense Capability
The status pin IS is used as a combined current sense and error flag output. In normal operation (current sense mode), a current source is connected to the status pin, which delivers a current proportional to the forward load current flowing through the active high side switch. If the high side switch is inactive or the current is flowing in the reverse direction no current will be driven except for a marginal leakage current IIS(LK). The external resistor RIS determines the voltage per output current. E.g. with the nominal value of 6k for the current sense ratio kILIS = IL / IIS, a resistor value of RIS = 1 k leads to VIS = (IL / 6 A)V. In case of a fault condition the status output is connected to a current source which is independent of the load current and provides IIS(lim). The maximum voltage at the IS pin is determined by the choice of the external resistor and the supply voltage. In case of current limitation the IIS(lim) is activated for 2 * tCLS.
Normal operation: current sense mode VS
ESD-ZD
Fault condition: error flag mode VS IS
ESD-ZD
IIS~ ILoad IIS(lim) Sense output logic
IIS~ ILoad RIS VIS IIS(lim) Sense output logic
IS R IS V IS
Figure 12
Sense Current and Fault Current
Data Sheet
19
Rev. 1.1, 2007-11-21
High Current PN Half Bridge BTN7930
Block Description and Characteristics
IIS
[mA]
IIS(lim)
er low
i kil
lue va s
hi
lis r ki ghe
u val
e
Current Sense Mode (High Side)
Error Flag Mode
ICLx
Figure 13 Sense Current vs. Load Current
IL
[A]
5.4.5
Truth Table
Inputs INH IN X 0 1 X 0 1 1 Outputs HSS OFF OFF ON ON LSS OFF ON OFF OFF IS 0 0 CS 1 Stand-by mode LSS active HSS active Shut-down of LSS, HSS activated, error detected UV lockout Stand-by mode, reset of latch Shut-down with latch, error detected Switched mode, error detected1) Switched mode, error detected1) Mode
Device State Normal Operation
Over-Voltage (OV)
X
Under-Voltage (UV) Overtemperature or Short Circuit of HSS or LSS Current Limitation Mode
X 0 1 1 1
X X X 1 0
OFF OFF OFF OFF ON
OFF OFF OFF ON OFF
0 0 1 1 1
1) Will return to normal operation after
tCLS; Error signal is reset after 2*tCLS (see Chapter 5.3.4)
Switches OFF = switched off ON = switched on Status Flag IS CS = Current sense mode 1 = Logic HIGH (error)
Inputs 0 = Logic LOW 1 = Logic HIGH X = 0 or 1
Data Sheet
20
Rev. 1.1, 2007-11-21
High Current PN Half Bridge BTN7930
Block Description and Characteristics
5.4.6
Electrical Characteristics - Control and Diagnostics
VS = 8 V to 18 V, Tj = -40 C to +150 C, all voltages with respect to ground, positive current flowing into pin
(unless otherwise specified) Pos. Parameter Control Inputs (IN and INH) 5.4.1 5.4.2 5.4.3 5.4.4 5.4.5 High level Voltage INH, IN Low level Voltage INH, IN Input Voltage hysteresis Input Current high level Input Current low level Symbol Min. Limit Values Typ. 1.75 1.6 1.4 350 200 30 25 Max. 2.15 2 - - - 150 125 V V mV A A - - - Unit Conditions
VINH(H) VIN(H) VINH(L) VIN(L) VINHHY VINHY IINH(H) IIN(H) IINH(L) IIN(L) kILIS
- - 1.1 - - - -
VIN = VINH = 5.3 V VIN = VINH = 0.4 V RIS = 1 k IL = 15 A IL = 8 A IL = 3 A VS = 13.5 V RIS = 1k VIN = 0 V or VINH = 0 V VIN = VINH = 5 V IL = 0 A
Current Sense 5.4.6 Current Sense ratio in static oncondition kILIS = IL / IIS 103 4.7 4.1 3.5 4 - - 6 6 6 5 - 1 8 8.5 9.5 6.5 1 80 mA A A
5.4.7 5.4.8 5.4.9
Maximum analog Sense Current, IIS(lim) Sense Current in fault Condition Isense Leakage current Isense Leakage current, active high side switch
IISL IISH
Data Sheet
21
Rev. 1.1, 2007-11-21
High Current PN Half Bridge BTN7930
Application Information
6
Application Information
Note: The following information is given as a hint for the implementation of the device only and shall not be regarded as a description or warranty of a certain functionality, condition or quality of the device.
6.1
Application Example
Microcontroller XC866
I/O Reset Vdd
CQ 22F
Voltage Regulator
WO RO Q D
CD 47nF
Reverse Polarity Protection
DZ 1 10V CS 470F R1 1k
TLE 4278G
GND
I VS
I/O
I/O
I/O
I/O
Vss
IPB 100P03P3L -04
RIN1 RINH1 10k 10k
BTN7930
INH IN IS SR OUT VS
CSc1 470nF CSc2 470nF
BTN7930
VS INH IN OUT IS SR GND GND
RINH2 10k
RIN2 10k
M
RIS12 470
RSR1 0..51k
RSR2 0..51k
High Current H-Bridge
Figure 14 Application Example: H-Bridge with two BTN7930 Note: This is a simplified example of an application circuit. The function must be verified in the real application.
6.2
Layout Considerations
Due to the fast switching times for high currents, special care has to be taken to the PCB layout. Stray inductances have to be minimized in the power bridge design as it is necessary in all switched high power bridges. The BTN7930 has no separate pin for power ground and logic ground. Therefore it is recommended to assure that the offset between the ground connection of the slew rate resistor, the current sense resistor and ground pin of the device (GND / pin 1) is minimized. If the BTN7930 is used in a H-bridge or B6 bridge design, the voltage offset between the GND pins of the different devices should be small as well. A ceramic capacitor from VS to GND close to each device is recommended to provide current for the switching phase via a low inductance path and therefore reducing noise and ground bounce. A reasonable value for this capacitor would be about 470 nF. The digital inputs need to be protected from excess currents (e.g. caused by induced voltage spikes) by series resistors in the range of 10 k.
Data Sheet
22
Rev. 1.1, 2007-11-21
High Current PN Half Bridge BTN7930
Application Information
6.3
Half-bridge Configuration Considerations
Please note that, if the BTN7930 is used in a half-bridge configuration with the load connected between OUT and GND and the supply voltage is exceeding the Overvoltage Switch-OFF level VOV(OFF), the implemented "Overvoltage Lock Out" feature leads to automatically turning on the high side switch, while turning off the low side switch, and therefore connecting the load to VS; independently of the current IN- and INH-pin signals (see also "Truth Table" on Page 20). This will lead to current flowing through the load, if not otherwise configured. It shall be insured that the power dissipated in the NovalithICTM does not exceed the maximum ratings. For further explanations see the application note "BTN79x0 Over Voltage (OV) Operation".
Microcontroller XC866
I/O Reset Vdd
CQ 22F
Voltage Regulator
WO RO Q D
CD 47nF
Reverse Polarity Protection
DZ 1 10V CS 470F R1 1k
TLE 4278G
GND
I VS
I/O
I/O
I/O
Vss
IPB 100P03P3L04
RIN 10k
RINH 10k
BTN7930
INH IN IS SR OUT VS
CSc 470nF
M
RIS 1k
RSR 0..51k
GND
High Current Half-Bridge
Figure 15 Application Example: Half-Bridge with a BTN7930 (Load to GND) Note: This is a simplified example of an application circuit. The function must be verified in the real application.
Data Sheet
23
Rev. 1.1, 2007-11-21
High Current PN Half Bridge BTN7930
Package Outlines
7
7.1
Package Outlines
PG-TO263-7-1
4.4 10 0.2 0...0.3
10.3
1.27 0.1 A B 0.05 2.4 0.1
4.7 0.5 2.7 0.3 7.551)
8.5 1)
(15)
9.25 0.2
0...0.15 7 x 0.6 0.1 6 x 1.27 0.25
M
0.5 0.1
AB
8 MAX.
0.1 B
1) Typical Metal surface min. X = 7.25, Y = 6.9 All metal surfaces tin plated, except area of cut.
Footprint
GPT09114
10.8
16.15 4.6
9.4
0.47 0.8 8.42
Figure 16
PG-TO263-7-1 (Plastic Green Transistor Single Outline Package)
Green Product (RoHS compliant) To meet the world-wide customer requirements for environmentally friendly products and to be compliant with government regulations the device is available as a green product. Green products are RoHS-Compliant (i.e Pb-free finish on leads and suitable for Pb-free soldering according to IPC/JEDEC J-STD-020).
For further information on alternative packages, please visit our website: http://www.infineon.com/packages. Data Sheet 24
Dimensions in mm Rev. 1.1, 2007-11-21
High Current PN Half Bridge BTN7930
Package Outlines
7.2
PG-TO220-7-11
10 0.2 9.9 0.2 8.5
1)
A 4.4 1.27 0.1
15.65 0.3
12.95
0...0.3
1)
2.8 0.2 3.7 -0.15
17 0.3
8.6 0.3
10.2 0.3
7 x 0.6 0.1 0...0.15 6 x 1.27
1)
C
3.7 0.3
0.5 0.1 3.9 0.4
2.4 0.25
M
AC
8.4 0.4
Typical Metal surface min. X = 7.25, Y = 12.3 All metal surfaces tin plated, except area of cut.
Figure 17
PG-TO220-7-11 (Plastic Green Transistor Single Outline Package)
Green Product (RoHS compliant) To meet the world-wide customer requirements for environmentally friendly products and to be compliant with government regulations the device is available as a green product. Green products are RoHS-Compliant (i.e Pb-free finish on leads and suitable for Pb-free soldering according to IPC/JEDEC J-STD-020).
For further information on alternative packages, please visit our website: http://www.infineon.com/packages. Data Sheet 25
1.6 0.3
Dimensions in mm Rev. 1.1, 2007-11-21
0.05
9.25 0.2
High Current PN Half Bridge BTN7930
Package Outlines
7.3
PG-TO220-7-12
10 0.2 9.9 0.2 8.5
1)
A
B 4.4 1.27 0.1
17 0.3 15.65 0.3
12.95
0...0.3
1)
2.8 0.2 3.7 -0.15
2.4
110.5
C 0...0.15
13 0.5
0.5 0.1 7 x 0.6 0.1 2.4
M
6 x 1.27
1)
0.25
ABC
Typical Metal surface min. X = 7.25, Y = 12.3 All metal surfaces tin plated, except area of cut.
Figure 18
PG-TO220-7-12 (Plastic Transistor Single Outline Package)
Green Product (RoHS compliant) To meet the world-wide customer requirements for environmentally friendly products and to be compliant with government regulations the device is available as a green product. Green products are RoHS-Compliant (i.e Pb-free finish on leads and suitable for Pb-free soldering according to IPC/JEDEC J-STD-020).
For further information on alternative packages, please visit our website: http://www.infineon.com/packages. Data Sheet 26
9.25 0.2
Dimensions in mm Rev. 1.1, 2007-11-21
0.05
High Current PN Half Bridge BTN7930
Revision History
8
Revision 1.1 1.0
Revision History
Date 2007-11-21 2007-11-06 Changes New packages added; Initial version Data Sheet
Data Sheet
27
Rev. 1.1, 2007-11-21
Edition 2007-11-21 Published by Infineon Technologies AG 81726 Munich, Germany (c) 2007 Infineon Technologies AG All Rights Reserved. Legal Disclaimer The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics. With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights of any third party. Information For further information on technology, delivery terms and conditions and prices, please contact the nearest Infineon Technologies Office (www.infineon.com). Warnings Due to technical requirements, components may contain dangerous substances. For information on the types in question, please contact the nearest Infineon Technologies Office. Infineon Technologies components may be used in life-support devices or systems only with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered.

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